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MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 0
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MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh

Sold by KHABIB GSM Tools Part
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From RM4.90
Est. delivery by Jul 21 - Jul 25
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KHABIB GSM Tools Part
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Jenis WarantiBahagian Alat Tangan

Product description

Kit Stensil Bebola Semula BGA CPU MaAnt Untuk Qualcomm HiSilicon MTK Papan Induk Telefon Android CPU IC Templat Timah Penanaman Jaringan Keluli
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 1
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 2
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 3
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 4
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 5
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 6
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 7
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 8
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 9
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 10
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 11

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