light
TikTok Shop Malaysia logo
Search
1/9
RM14.39

MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh

Sold by KHABIB GSM Tools Part
4 sold

Select options

Select

Shipping

From RM4.90
Est. delivery by Apr 22 - Apr 26

Specifications

KHABIB GSM Tools Part
405 items
Shop performance
Better than 72% of other shops
Ships within 2 days
75%

About this product

Jenis WarantiBahagian Alat Tangan

Product description

Kit Stensil Bebola Semula BGA CPU MaAnt Untuk Qualcomm HiSilicon MTK Papan Induk Telefon Android CPU IC Templat Timah Penanaman Jaringan Keluli
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 1
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 2
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 3
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 4
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 5
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 6
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 7
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 8
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 9
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 10
Product Introduction of MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh 11
You may also like
Womenswear & Underwear
Phones & Electronics
Fashion Accessories
Menswear & Underwear
Home Supplies
Beauty & Personal Care
Shoes
Sports & Outdoor
Luggage & Bags
Toys & Hobbies
No more products
TikTok Shop promo codes
Sell on TikTok ShopSeller center
About TikTok ShopContact usCareersAffiliate
Help centerSafety centerCommunity guidelines
TransparencyAccessibility
Open TikTok