Product description
It is applicable for mobile phones, PC cards,BGA and other sophisticated electronic chip-level flux welding.Easy to use, no residue and clean.
Advantage: Non-toxic, non-corrosive, good insulation, smooth welding surface, no deterioration no dry.
Function: It cleans and prevents metal oxidation, so it is effective to allows solder to create strong, long lasting mechanical and electrical bonds.
Easy to use: Easy to use, no residue and clean.
No Corrosion: There is no corrosion to IC and PCB.
Boiling point: It is only slightly higher than the melting point of the solder
Safe to use: Environmental and nontoxic, odourless and stable for use.
Application: It is applicable for mobile phones, PC cards,BGA and other sophisticated electronic chip-level flux welding.
1. Use the end of a match or toothpick, apply a little soldering paste to the leads which need to be soldered.
2. Place the soldering iron tip over the leads. Making the solder against these leads.
Heat the solder till it flows freely, then move the soldering iron and solder away in a rapid speed.
1. Please allowed slight difference due to manual measurement, thank you!
2. Due to the difference between different monitors, please understand that the picture may not reflect the actual color of the item.