Thermal Pad GPU CPU Heatsink Cooling Conductive Silicon 20x20x1mm Blue color

Features:

1. Insulation, heat conduction, wear resistance, flame retardant, filling gap, anti compression, buffer and so on.

2. Applicable to electronic and electrical products control motherboard, motor, electronic appliances, automotive machinery, computer host, notebook computer, DVD, VCD, LID, set top box and any need to fill and heat dissipation module material.

3. Reduce the contact thermal resistance between the heat source surface and the radiator contact surface.

4. The thermal conductive silica gel can well fill the gap between the contact surfaces.

5. The contact surface between the heat source and the radiator can be fully contacted, and the contact between the heat source and the radiator can be achieved. The reaction at the temperature can reach as little as possible the temperature difference.

6. The range of thermal conductivity and stability of thermally conductive silicon film.

7. The heat conduction silicone pad in the structure craft difference repair, reduces the radiator and the heat dissipation structure craft difference request.